Semiconductor packaging test
IC packaging products of Doberu Technology Co.，Ltd. are mainly divided into four categories, including wbga, LGA, fbga-ssd, SIP EMCP & USB, which can produce DRAM, EMCP, sip, SSD and LED point receiving products.
◆ DRAM / flash product packaging test
◆ LED spot test
◆ LGA package of fingerprint identification chip
◆ Memory module assembly
